Solutions & Capabilites

OTM’s process automation engineers can optimize the performance of manufacturing systems by identifying the best techniques and process controls for each customer to achieve faster throughput and time to market.

Some of our capabilities include:

FAILURE ANALYSIS (FA)

  • Cross Section
  • X-Ray
  • Dye & Pry
  • Optical Measuring Microscope
  • ERSA Endoscope
  • Strain Gauge
  • SEM-EDS
  • FTIR

SAFETY TESTING

  • Current Limit
  • Discharge of Capacitors Test
  • Overload Test
  • Components Short / Open Test
  • Temperature Test
  • Ball press Test
  • Overload Test

MECHANICAL RELIABILITY TESTING

  • 3G Vibration
  • Scratch & Abrasion
  • Repeated Drop
  • Tensile
  • Compression / Crush
  • Connector Side Load
  • Tumble
  • Guided Drop

ADVANCED ASSEMBLY

  • Macro Assembly
  • Wafer Level

We also provide electronic manufacturing design and manufacturing services for PCBs, PCBAs and systems. In addition, our manufacturing capabilities include sheet metal enclosure fabrication, frame welding, precision machining, electromechanical assembly and test.